Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K

SKU
HTK-002-U1-GP
£11.34 £9.45
In stock
0.8 °C/W, 550 volts/mil, 21.7 kV/mm
  • Suitable for CPU, chipsets on Mainboard, VGA card, etc
  • Easy to use
  • Zif Socket Templates ensure correct applying area with various CPU socket types
  • Produces an even layer when using applicator
  • Dielectric
  • Wide range of application temperature
More Information
Type Thermal paste
SKU HTK-002-U1-GP
EAN 4719512002940
Manufacturer Cooler Master
Availability Y
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
Features
TypeThermal paste
Thermal resistance0.8 °C/W
Thermal conductivity4.5 W/m·K
Product colourWhite
Specific gravity2.37 g/cm³
Packaging data
Package width102 mm
Package depth171 mm
Package height40 mm
Quantity per pack1 pc(s)
Technical details
Thermal resistance0.8 °C/W
Thermal conductivity4.5 W/m·K
Weight & dimensions
Package width102 mm
Package depth171 mm
Package height40 mm
Colour
Product colourWhite
Logistics data
Quantity per pack1 pc(s)

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SKU
HTK-002-U1-GP
ACTCP00001B
ACTCP00008B
TG-G3.0-01
TG-G15-02
ACTCP00031B
Manufacturer
Cooler Master
ARCTIC
ARCTIC
Gembird
Gembird
ARCTIC
Type
Thermal paste
Thermal paste
Thermal paste
N/A
Thermal paste
Thermal paste